Observatorio de I+D+i UPM

Memorias de investigación
Communications at congresses:
Optimal Mechanical Design of Modular Haptic Devices
Year:2011
Research Areas
  • Engineering,
  • Electric engineers, electronic and automatic (eil)
Information
Abstract
This paper presents two possible mechanical designs for a modular haptic device. In a modular haptic device, each module allows the interaction with a scenario by using a single finger, and by adding more modules, multi-finger interaction can be achieved. In this paper, two different mechanical designs for such haptic modules are presented and compared (4-bar and 5-bar mechanisms). This comparison is performed in terms of inertia, manipulability, workspace width, homogeneity of forces reflection and the resulting direct kinematics and jacobian equations. Moreover, it is described how these modules can be scaled to provide haptic feedback to multiple fingers.
International
Si
Congress
2011IEEE/RSJ INTERNATIONAL CONFERENCE ON INTELLIGENT ROBOTS AND SYSTEMS
960
Place
Hungría
Reviewers
Si
ISBN/ISSN
2159-6247
10.1109/AIM.2011.6027150
Start Date
03/07/2011
End Date
07/07/2011
From page
98
To page
103
Advanced Intelligent Mechatronics (AIM), 2011 IEEE/ASME International Conference on
Participants
  • Autor: Jose Manuel Breñosa Martinez (UPM)
  • Autor: Ignacio Galiana Bujanda (UPM)
  • Autor: Manuel Ferre Perez (UPM)
  • Autor: Rafael Aracil Santonja (UPM)
Research Group, Departaments and Institutes related
  • Creador: Grupo de Investigación: Robots y máquinas inteligentes
  • Centro o Instituto I+D+i: Centro de Automática y Robótica (CAR). Centro Mixto UPM-CSIC
  • Departamento: Automática, Ingeniería Electrónica e Informática Industrial
S2i 2019 Observatorio de investigación @ UPM con la colaboración del Consejo Social UPM
Cofinanciación del MINECO en el marco del Programa INNCIDE 2011 (OTR-2011-0236)
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