Memorias de investigación
Ponencias en congresos:
Temperature Sensor Placement Including Routing Overhead and Sampling Inaccuracies
Año:2012
Áreas de investigación
  • Circuitos electrónicos,
  • Diseño microelectrónico,
  • Dispositivos sensores
Datos
Descripción
Dynamic thermal management techniques require a collection of on-chip thermal sensors that imply a significant area and power overhead. Finding the optimum number of temperature monitors and their location on the chip surface to optimize accuracy is an NP-hard problem. In this work we improve the modeling of the problem by including area, power and networking constraints along with the consideration of three inaccuracy terms: spatial errors, sampling rate errors and monitor-inherent errors. The problem is solved by the simulated annealing algorithm. We apply the algorithm to a test case employing three different types of monitors to highlight the importance of the different metrics. Finally we present a case study of the Alpha 21364 processor under two different constraint scenarios.
Internacional
Si
Nombre congreso
Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), 2012 International Conference on
Tipo de participación
960
Lugar del congreso
Sevilla
Revisores
Si
ISBN o ISSN
978-1-4673-0685-0
DOI
10.1109/SMACD.2012.6339419
Fecha inicio congreso
19/09/2012
Fecha fin congreso
21/09/2012
Desde la página
69
Hasta la página
72
Título de las actas
Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), 2012 International Conference on
Esta actividad pertenece a memorias de investigación
Participantes
Grupos de investigación, Departamentos, Centros e Institutos de I+D+i relacionados
  • Creador: Grupo de Investigación: Laboratorio de Sistemas Integrados (LSI)
  • Departamento: Ingeniería Electrónica