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Descripción
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| The main objective of this work is to adapt the Laser Induced Forward Transfer (LIFT), a well-known laser direct writing technique for material transfer, to define metallic contacts (fingers and busbars) onto c-Si cells and to use continuous wave laser sources to curing and sintering the deposited line. Commercial silver pastes (with viscosity around 30-50 kcPs) are applied over a donor glass substrate using a coater with a controlled thickness in the range of tens of microns. A solid state pulsed laser (532 nm) is focused at the glass/silver interface producing a droplet of silver that it is transferred to an acceptor substrate. Lines are drawn by means of scanning the laser spot. The influence of the process parameters (silver paste thickness, gap between donor and acceptor, and laser parameters - spot size, pulse energy and overlapping of pulses) is studied as a function of the morphology of the deposited lines using confocal and scanning electron microscopy. With an appropriate process parameterization it is possible to transfer a high paste volume per pulse (? 400 pL) and then large aspect ratio lines (? 0.5) can be drawn at high speeds (2 m/s). After the printing process a continuous wave green laser is used to heat the silver paste line to remove the organic layer (curing) or even to produce some melting between the silver grains (sintering) in order to reduce the line resistance. Process parameters such as laser power, spot size, processing velocity, and number of scans are studied. Results show that all-laser based metallization processes are possible. | |
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Internacional
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Si |
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Nombre congreso
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Lasers in Manufacturing Conference 2015 |
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Tipo de participación
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960 |
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Lugar del congreso
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Munich (Alemania) |
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Revisores
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Si |
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ISBN o ISSN
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CDP08UPM |
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DOI
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Fecha inicio congreso
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22/06/2015 |
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Fecha fin congreso
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25/06/2015 |
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1 |
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Hasta la página
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7 |
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Título de las actas
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Lasers in Manufacturing Proceedings 2015 http://www.wlt.de/lim/ |