Descripción
|
|
---|---|
Epoxy resins are widely used as matrices of reinforced composites, adhesives and surface coatings, with application as electrical insulation materials and electronic components. The thermal conductivity of electrically insulating epoxy thermosets can be achieved adding fillers like boron nitride (BN) in order to dissipate the heat generated in electronic devices. Previous investigations have reported that the addition of BN micro-particles allowed increasing thermal conductivity without loss of thermal and mechanical properties of thermally cured epoxy thermosets. Ultraviolet polymerizable epoxies used as coatings are relative new epoxy systems containing UV-activated cationic initiators. 3,4-epoxycyclohexylmethyl-3¿,4¿-epoxycyclohexanecarboxylate (EEC), is the most common photocurable epoxy resin, due to their good properties such as: high UV resistance, transparency, and low toxicity. In this work the effect of BN nanoparticles on UV and thermal curing of EEC epoxy using a cationic photoinitiator investigated. Moreover the thermo-mechanical properties and surface energy of the cured nanocomposites were studied. | |
Internacional
|
Si |
DOI
|
|
Edición del Libro
|
1 |
Editorial del Libro
|
Universidad Carlos III Madrid |
ISBN
|
978-84-16829-27-9 |
Serie
|
|
Título del Libro
|
XIX CONGRESO INTERNACIONAL DE ADHESIÓN Y ADHESIVOS CONGRESO DE ADHESIÓN & ADHESIV |
Desde página
|
26 |
Hasta página
|
33 |