Memorias de investigación
Ponencias en congresos:
Comparison of Different FE Models for the Simulation of the Ring/Ball on Ring Test
Año:2010
Áreas de investigación
  • Arquitectura
Datos
Descripción
Monocrystalline silicon wafers are widely used in photovoltaic industry. The trend towards thinner wafers leads to higher breakage rates in the production process. In this context, the characterization of the mechanical strength becomes necessary. Different fracture tests as the ring/ball on ring are carried out. This paper presents different ways to simulate these tests. Analytical methods are applied in a first step. Simplified FE models (with shell elements and an axisymmetric model) that take into account non linearities existing in the test are presented and a 3d solid model is detailed. Results in terms of calculation time, stress distribution, adjustment to the tests and fitting to a Weibull distribution are compared
Internacional
Si
Nombre congreso
Tenth International Conference on Computational Structures Technology
Tipo de participación
960
Lugar del congreso
Valencia
Revisores
Si
ISBN o ISSN
1759-3433
DOI
10.4203/ccp.93.252
Fecha inicio congreso
14/09/2010
Fecha fin congreso
17/09/2010
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0
Hasta la página
0
Título de las actas
"Proceedings of the Tenth International Conference on Computational Structures Technology", Civil-Comp Press, Stirlingshire, UK
Esta actividad pertenece a memorias de investigación
Participantes
Grupos de investigación, Departamentos, Centros e Institutos de I+D+i relacionados
  • Creador: Grupo de Investigación: Ingeniería Sísmica: Dinámica de Suelos y Estructuras
  • Departamento: Mecánica Estructural y Construcciones Industriales