Ponencias en congresos:
Design of an Efficient Interconnection Network of Temperature Sensors
Año:2010
Áreas de investigación
- Equipo electrónico
Datos
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Descripción
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| Temperature has become a first class design con- straint because high temperatures adversely affect circuit relia- bility, static power and degrade the performance. In this scenario, thermal characterization of ICs and on-chip temperature moni- toring represent fundamental tasks in electronic design. In this work, we analyze the features that an interconnection network of temperature sensors must fulfill. Departing from the network topology, we continue with the proposal of a very light-weight network architecture based on digitalization resource sharing. Our proposal supposes a 16% improvement in area and power consumption compared to traditional approaches. | |
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Internacional
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Si |
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Nombre congreso
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25th Conference on Design of Circuits and Integrated Systems (DCIS'10) |
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Tipo de participación
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960 |
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Lugar del congreso
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Lanzarote, Spain |
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Revisores
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Si |
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ISBN o ISSN
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9788469373934 |
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DOI
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Fecha inicio congreso
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17/11/2010 |
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Fecha fin congreso
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19/11/2010 |
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Desde la página
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607 |
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Hasta la página
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612 |
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Título de las actas
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25th Conference on Design of Circuits and Integrated Systems Proceedings |
Ver publicación en Archivo digital upm
Esta actividad pertenece a memorias de investigación
Participantes
- Autor: Pablo Ituero Herrero UPM
- Autor: M. Luisa Lopez Vallejo UPM
Grupos de investigación, Departamentos, Centros e Institutos de I+D+i relacionados
- Creador: Grupo de Investigación: Laboratorio de Sistemas Integrados (LSI)
- Departamento: Ingeniería Electrónica