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Abstract
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| Correct operation of electronic assemblies is subject to their regulation in the temperature range recommended by manufacturers. It is therefore necessary to control the heat exchange phenomena that affect them. When thermoregulation of these assemblies is based on thermocouples, the effects of fluid flow on the junctions of these sensors must be considered, particularly the thermal and velocity gradients | |
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International
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Si |
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Congress
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10th WSEAS International Conference on Applications of Electrical Engineering (AEE '11) |
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960 |
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Place
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Gran Canaria (España) |
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Reviewers
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Si |
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ISBN/ISSN
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978-960-474-286-8 |
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Start Date
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24/03/2011 |
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End Date
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26/03/2011 |
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From page
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89 |
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To page
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94 |
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Recent Researches in Communications, Electrical & Computing Engineering |