Memorias de investigación
Communications at congresses:
Thermoregulation of electronics inside diode enclosures. Viscous shear stress in 2D natural convection generated by isothermal active walls
Year:2011

Research Areas
  • Classic thermodynamic, transference of the heat,
  • Numerical simulation

Information
Abstract
Correct operation of electronic assemblies is subject to their regulation in the temperature range recommended by manufacturers. It is therefore necessary to control the heat exchange phenomena that affect them. When thermoregulation of these assemblies is based on thermocouples, the effects of fluid flow on the junctions of these sensors must be considered, particularly the thermal and velocity gradients
International
Si
Congress
10th WSEAS International Conference on Applications of Electrical Engineering (AEE '11)
960
Place
Gran Canaria (España)
Reviewers
Si
ISBN/ISSN
978-960-474-286-8
Start Date
24/03/2011
End Date
26/03/2011
From page
89
To page
94
Recent Researches in Communications, Electrical & Computing Engineering
Participants

Research Group, Departaments and Institutes related
  • Creador: Grupo de Investigación: Análisis Térmico y Ventilación en la Ingeniería y la Edificación
  • Departamento: Física Aplicada