Memorias de investigación
Ponencias en congresos:
Study of the Mechanical Strength Improvement of Wafers for EWT Solar Cells by Chemical Etching after the Drilling Process
Año:2011
Áreas de investigación
  • Ingenierías,
  • Tecnología electrónica y de las comunicaciones
Datos
Descripción
Mechanical stability of EWT solar cells deteriorates when holes are created in the wafer. Nevertheless, the chemical etching after the hole generation process improves the mechanical strength by removing part of the damage produced in the drilling process. Several sets of wafers with alkaline baths of different duration have been prepared. The mechanical strength has been measured by the ring on ring bending test and the failure stresses have been obtained through a FE simulation of the test. This paper shows the comparison of these groups of wafers in order to obtain an optimum value of the decreased thickness produced by the chemical etching.
Internacional
Si
Nombre congreso
26th European Photovoltaic Solar Energy Conference and Exhibition
Tipo de participación
960
Lugar del congreso
Hamburgo, Alemania
Revisores
Si
ISBN o ISSN
3-936338-27-2
DOI
10.4229/26thEUPVSEC2011-2BV.2.56
Fecha inicio congreso
05/09/2011
Fecha fin congreso
09/09/2011
Desde la página
1589
Hasta la página
1592
Título de las actas
26th European Photovoltaic Solar Energy Conference Proceedings of the International Conference held in Hamburg, Germany 5 - 9 September 2011
Esta actividad pertenece a memorias de investigación
Participantes
Grupos de investigación, Departamentos, Centros e Institutos de I+D+i relacionados
  • Creador: Grupo de Investigación: Ingeniería Sísmica: Dinámica de Suelos y Estructuras