Memorias de investigación
Ponencias en congresos:
Damage Reduction of the Laser Drilling Process on Back Contact Solar Cells by Chemical Treatment
Año:2012
Áreas de investigación
  • Ingenierías
Datos
Descripción
Production of back contact solar cells requires holes generations on the wafers to keep both positive and negative contacts on the back side of the cell. This drilling process weakens the wafer mechanically due to the presence of the holes and the damage introduced during the process as microcracks. In this study, several chemical processes have been applied to drilled wafers in order to eliminate or reduce the damage generated during this fabrication step. The treatments analyzed are the followings: alkaline etching during 1, 3 and 5 minutes, acid etching for 2 and 4 minutes and texturisation. To determine mechanical strength of the samples a common mechanical study has been carried out testing the samples by the Ring on Ring bending test and obtaining the stress state in the moment of failure by FE simulation. Finally the results obtained for each treatment were fitted to a three parameter Weibull distribution
Internacional
Si
Nombre congreso
27th European Photovoltaic Solar Energy Conference and Exhibition
Tipo de participación
960
Lugar del congreso
Frankfurt, Germany
Revisores
Si
ISBN o ISSN
3-936338-28-0
DOI
10.4229/27thEUPVSEC2012-2DO.2.3
Fecha inicio congreso
24/09/2012
Fecha fin congreso
28/09/2012
Desde la página
832
Hasta la página
835
Título de las actas
27th European Photovoltaic Solar Energy Conference and Exhibition Proceedings of the international Conference held in Frankfurt, Germany 24 - 28 September 2012
Esta actividad pertenece a memorias de investigación
Participantes
Grupos de investigación, Departamentos, Centros e Institutos de I+D+i relacionados
  • Creador: Grupo de Investigación: Ingeniería Sísmica: Dinámica de Suelos y Estructuras