Memorias de investigación
Artículos en revistas:
Characterisation of aluminium nitride films and surface acoustic wave devices for microfluidic applications
Año:2014

Áreas de investigación
  • Tecnología electrónica y de las comunicaciones

Datos
Descripción
Aluminium nitride (AlN) films with different thicknesses (from 2.3 to 4.7 microns) were deposited ontohigh resistivity silicon substrates using magnetron sputtering. Crystalline and bonding structures of thedeposited AlN films were characterised. The AlN films showed a highly c-axis texture. AlN film based sur-face acoustic wave (SAW) devices were fabricated and characterised. The SAW devices showed Rayleighwave transmission band with a large side-lobe suppression of ?15 dB. With the increase in film thickness,both the central band frequency and electromechanical coupling coefficient were increased, and valuesof temperature coefficient of frequency was increased linearly from ?21.3 to ?27.4 ppm/K. Microfluidicmanipulations including streaming, pumping and jetting have been realised using AlN SAW devices. Theapplied RF power boundary between streaming and pumping and that between the pumping and jettingdecreased with the increase of film thickness. The measured streaming and pumping velocities as wellas device surface temperatures increased with the film thickness.
Internacional
Si
JCR del ISI
Si
Título de la revista
Sensors And Actuators B-Chemical
ISSN
0925-4005
Factor de impacto JCR
3,84
Información de impacto
Volumen
202
DOI
Número de revista
Desde la página
984
Hasta la página
992
Mes
SIN MES
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Participantes
  • Autor: Mario De Miguel Ramos UPM
  • Autor: Enrique Iborra Grau UPM
  • Autor: Jimena Olivares Roza UPM
  • Autor: J. Zhou Department of Information Science and Electronic Engineering, Zhejiang University, Hangzhou, China
  • Autor: L. Garcia-Gancedo Electrical Engineering Division, Department of Engineering, University of Cambridge, Cambridge, UK
  • Autor: H. Jin Department of Information Science and Electronic Engineering, Zhejiang University, Hangzhou, China
  • Autor: J.K. Luo Department of Information Science and Electronic Engineering, Zhejiang University, Hangzhou, China
  • Autor: A.S. Elhady Thin Film Centre, Scottish Universities Physics Alliance (SUPA), University of the West of Scotland, Paisley, UK
  • Autor: S.R. Dong Department of Information Science and Electronic Engineering, Zhejiang University, Hangzhou, China
  • Autor: D.M. Wang Department of Information Science and Electronic Engineering, Zhejiang University, Hangzhou, China
  • Autor: Y.Q. Fu Thin Film Centre, Scottish Universities Physics Alliance (SUPA), University of the West of Scotland, Paisley, UK

Grupos de investigación, Departamentos, Centros e Institutos de I+D+i relacionados
  • Creador: Grupo de Investigación: Microsistemas y Materiales Electrónicos
  • Departamento: Ingeniería Electrónica
  • Centro o Instituto I+D+i: Centro de Materiales y Dispositivos Avanzados para Tecnologías de Información y Comunicaciones