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Memorias de investigación
Artículos en revistas:
Effects of compensating the temperature coefficient of frequency with the acoustic reflector layers on the overall performance of solidly mounted resonators
Año:2017
Áreas de investigación
  • Tecnología electrónica y de las comunicaciones
Datos
Descripción
Thin film acoustic wave resonator based devices require compensation of temperature coefficient of frequency (TCF) in many applications. This work presents the design and fabrication of temperature compensated solidly mounted resonators (SMRs). The characteristics of each material of the layered structure have an effect on the device TCF but depending on the relative position with respect to the piezoelectric material in the stack. The influence of material properties of the different layers composing the device on the TCF is discussed in detail. TCF behavior simulation is done with Mason?s model and, to take into account the deterioration of overall performance due to the finite lateral size and shape of the resonator, we have used 2D and 3D finite element modelling of the resonators. The overall behavior of the device for external loads is predicted. SMRs are designed according to simulations and fabricated with different configurations to obtain TCF as near to zero as possible with an optimized response. Resonators are made by depositing Mo/AlN/Mo piezoelectric stacks on acoustic reflectors. As reflector materials, conductive W and insulating WOx films have been used as high acoustic impedance materials. SiO2 films are used as low acoustic impedance material.
Internacional
Si
JCR del ISI
Si
Título de la revista
Ultrasonics
ISSN
0041-624X
Factor de impacto JCR
1,942
Información de impacto
Datos JCR del año 2014
Volumen
74
DOI
10.1016/j.snb.2016.01.131
Número de revista
Desde la página
153
Hasta la página
160
Mes
SIN MES
Ranking
Participantes
  • Autor: Junaid Munir (Universiti Teknologi Malaysia)
  • Autor: Teona Mirea (UPM)
  • Autor: Mario De Miguel Ramos (UPM)
  • Autor: M. A. Saeed (Universiti Teknologi Malaysia;University of Education (Pakistan))
  • Autor: Amiruddin Bin Shaari (Universiti Teknologi Malaysia)
  • Autor: Enrique Iborra Grau (UPM)
Grupos de investigación, Departamentos, Centros e Institutos de I+D+i relacionados
  • Departamento: Ingeniería Electrónica
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