Memorias de investigación
Ponencias en congresos:
Reliable Design Methodology: The Combined Effect of Radiation, Variability and Temperature
Año:2016

Áreas de investigación
  • Tecnología electrónica y de las comunicaciones

Datos
Descripción
The effects caused by variability, temperature, radiation or aging may compromise the reliability of electronic circuits. Circuits designers must consider their combined effects early during the design cycle, even though it is a time and effort demanding task. In this work we present a methodology and simulation framework for the reliable design of circuits working under realistic conditions such as a wide range of temperatures, radiation and process variations. This proposal provides an alternative method for validating digital and analog circuits. Depending on the analyzed circuit functionality, the user is able to define complex reliability metrics such as signal upsets, delays or frequency deviations to measure the circuit response in affordable simulation time.
Internacional
Si
Nombre congreso
Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), 2016 13th International Conference on
Tipo de participación
960
Lugar del congreso
Lisboa
Revisores
Si
ISBN o ISSN
978-1-5090-0490-4
DOI
10.1109/SMACD.2016.7520646
Fecha inicio congreso
27/06/2016
Fecha fin congreso
30/06/2016
Desde la página
0
Hasta la página
1
Título de las actas
Reliable design methodology: The combined effect of radiation, variability and temperature

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Participantes

Grupos de investigación, Departamentos, Centros e Institutos de I+D+i relacionados
  • Creador: Grupo de Investigación: Laboratorio de Sistemas Integrados (LSI)
  • Centro o Instituto I+D+i: Centro de I+d+i en Procesado de la Información y Telecomunicaciones
  • Departamento: Ingeniería Electrónica