Memorias de investigación
Capítulo de libro:
Cycloaliphatic epoxy adhesives filled with BN-nanoparticles: UV curing, thermal curing and properties
Año:2018

Áreas de investigación
  • Tecnología química

Datos
Descripción
Epoxy resins are widely used as matrices of reinforced composites, adhesives and surface coatings, with application as electrical insulation materials and electronic components. The thermal conductivity of electrically insulating epoxy thermosets can be achieved adding fillers like boron nitride (BN) in order to dissipate the heat generated in electronic devices. Previous investigations have reported that the addition of BN micro-particles allowed increasing thermal conductivity without loss of thermal and mechanical properties of thermally cured epoxy thermosets. Ultraviolet polymerizable epoxies used as coatings are relative new epoxy systems containing UV-activated cationic initiators. 3,4-epoxycyclohexylmethyl-3¿,4¿-epoxycyclohexanecarboxylate (EEC), is the most common photocurable epoxy resin, due to their good properties such as: high UV resistance, transparency, and low toxicity. In this work the effect of BN nanoparticles on UV and thermal curing of EEC epoxy using a cationic photoinitiator investigated. Moreover the thermo-mechanical properties and surface energy of the cured nanocomposites were studied.
Internacional
Si
DOI
Edición del Libro
1
Editorial del Libro
Universidad Carlos III Madrid
ISBN
978-84-16829-27-9
Serie
Título del Libro
XIX CONGRESO INTERNACIONAL DE ADHESIÓN Y ADHESIVOS CONGRESO DE ADHESIÓN & ADHESIV
Desde página
26
Hasta página
33

Esta actividad pertenece a memorias de investigación

Participantes
  • Autor: Andrés González González UPM- Pas en la ETSIDI
  • Autor: Margarita Gonzalez Prolongo UPM
  • Autor: Carmen Arribas Arribas UPM
  • Autor: Alberto Jiménez Suarez Universidad Rey Juan Carlos Madrid
  • Autor: Silvia González Prolongo Universidad Rey Juan Carlos Madrid

Grupos de investigación, Departamentos, Centros e Institutos de I+D+i relacionados
  • Creador: Grupo de Investigación: Grupo de Propiedades de materiales Poliméricos (GPMP)