Ponencias en congresos:
Real time thin-film thickness monitoring sensors: a comparative study of dual mode Solidly Mounted Resonators with commercial Quartz Crystal Microbalances
Real time thin-film thickness monitoring sensors: a comparative study of dual mode Solidly Mounted Resonators with commercial Quartz Crystal Microbalances
Año:2019
Áreas de investigación
-
Dispositivos sensores, -
Otros dispositivos electrónicos,
-
Materiales para ingeniería eléctrica y electrónica,
-
Tecnología de dispositivos para ingeniería eléctrica y electrónica
Datos
|
Descripción
|
|
|---|---|
| Next generations of physical and chemical vacuum deposition systems require more accurate and faster sensors to monitor the deposition of very thin films (nm range). Acoustic sensors, particularly QCMs, have been typically used in such systems. However, their potential has reached certain limitations. They are bulky, they need a water-cooling system to work at higher temperatures, and for certain applications their response time is not fast enough. For many years, film bulk acoustic wave resonators (FBARs) working at higher frequencies have been studied as a higher sensitivity alternative to QCMs, particularly in biosensing applications. However, they have been never applied and simultaneously compared to QCMs in an actual PVD system so far. Sorex Sensors has developed an FBAR which not only offers higher mass sensitivity than QCMs but also allows discriminating temperature related effects within the same device without the need of a reference sensor. FBARs can also be integrated in arrays providing a cost-effective and more accurate solution for thin film monitoring. This sensor has been tested simultaneously with a commercial QCM in an evaporator, for benchmarking the characteristic of both technologies in terms of sensitivity. | |
|
Internacional
|
Si |
|
Nombre congreso
|
2019 IEEE INTERNATIONAL ULTRASONICS SYMPOSIUM (IUS) |
|
Tipo de participación
|
960 |
|
Lugar del congreso
|
Glasgow, UK |
|
Revisores
|
Si |
|
ISBN o ISSN
|
1948-5719 |
|
DOI
|
|
|
Fecha inicio congreso
|
06/10/2019 |
|
Fecha fin congreso
|
09/10/2019 |
|
Desde la página
|
600 |
|
Hasta la página
|
602 |
|
Título de las actas
|
PROCEEDINGS OF THE 2019 IEEE INTERNATIONAL ULTRASONICS SYMPOSIUM (IUS) |
Ver publicación en Archivo digital upm
Participantes
- Autor: Teona Mirea (UPM)
Grupos de investigación, Departamentos, Centros e Institutos de I+D+i relacionados
- Creador: Grupo de Investigación: Microsistemas y Materiales Electrónicos
- Departamento: Ingeniería Electrónica
S2i 2023 Observatorio de investigación @ UPM con la colaboración del Consejo Social UPM
Cofinanciación del MINECO en el marco del Programa INNPACTO (IPT-020000-2010-22)