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Abstract
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| Trabajos realizados con un sensor con sensores de contacto para manipulación de objetos virtuales. | |
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International
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Si |
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Congress
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IEEE International Conference on Mechatronics - ICM |
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960 |
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Place
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Malaga,Spain |
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Reviewers
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Si |
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ISBN/ISSN
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978-1-4244-4194-5 |
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Start Date
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14/04/2009 |
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End Date
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17/04/2009 |
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From page
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0 |
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To page
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0 |
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Sensorized Thimble for Haptics Applications |