Memorias de investigación
Communications at congresses:
Design of an Efficient Interconnection Network of Temperature Sensors
Year:2010

Research Areas
  • Electronic equipment

Information
Abstract
Temperature has become a first class design con- straint because high temperatures adversely affect circuit relia- bility, static power and degrade the performance. In this scenario, thermal characterization of ICs and on-chip temperature moni- toring represent fundamental tasks in electronic design. In this work, we analyze the features that an interconnection network of temperature sensors must fulfill. Departing from the network topology, we continue with the proposal of a very light-weight network architecture based on digitalization resource sharing. Our proposal supposes a 16% improvement in area and power consumption compared to traditional approaches.
International
Si
Congress
25th Conference on Design of Circuits and Integrated Systems (DCIS'10)
960
Place
Lanzarote, Spain
Reviewers
Si
ISBN/ISSN
9788469373934
Start Date
17/11/2010
End Date
19/11/2010
From page
607
To page
612
25th Conference on Design of Circuits and Integrated Systems Proceedings
Participants

Research Group, Departaments and Institutes related
  • Creador: Grupo de Investigación: Laboratorio de Sistemas Integrados (LSI)
  • Departamento: Ingeniería Electrónica