Descripción
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EWT back contact solar cells are manufactured from very thin silicon wafers. These wafers are drilled by means of a laser process creating a matrix of tiny holes with a density of approximately 125 holes per square centimeter. Their influence in the stiffness and mechanical strength has been studied. To this end, both wafers with and without holes have been tested with the ring on ring test. Numerical simulations of the tests have been carried out through the Finite Element Method taking into account the non-linearities present in the tests. It?s shown that one may use coarse meshes without holes to simulate the test and after that sub models are used for the estimation of the stress concentration around the holes. | |
Internacional
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Si |
Nombre congreso
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11th International Conference on the Mechanical Behavior of Materials |
Tipo de participación
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960 |
Lugar del congreso
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Lago Como, Italia |
Revisores
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Si |
ISBN o ISSN
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1877-7058 |
DOI
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10.1016/j.proeng.2011.04.534 |
Fecha inicio congreso
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06/06/2011 |
Fecha fin congreso
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09/06/2011 |
Desde la página
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3244 |
Hasta la página
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3249 |
Título de las actas
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Procedia Engineering, Volume 10, 2011 |