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Memorias de investigación
Research Publications in journals:
Thermal analysis and modeling of embedded processors
Year:2010
Research Areas
  • Microelectronics
Information
Abstract
This paper presents a complete modeling approach to analyze the thermal behavior of microprocessor-based systems. While most compact modeling approaches require a deep knowledge of the implementation details, our method defines a black box technique which can be applied to different target processors when this detailed information is unknown. The obtained results show high accuracy, applicability and can be easily automated. The proposed methodology has been used to study the impact of code transformations in the thermal behavior of the chip. Finally, the analysis of the thermal effect of the source code modifications can be included in a temperature-aware compiler which minimizes the total temperature of the chip, as well as the temperature gradients, according to these guidelines.
International
Si
JCR
Si
Title
COMPUTERS AND ELECTRICAL ENGINEERING
ISBN
0045-7906
Impact factor JCR
0,475
Impact info
Volume
36
Journal number
1
From page
142
To page
154
Month
ENERO
Ranking
Participants
  • Autor: M. Luisa Lopez Vallejo (UPM)
Research Group, Departaments and Institutes related
  • Creador: Grupo de Investigación: Laboratorio de Sistemas Integrados (LSI)
  • Departamento: Ingeniería Electrónica
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Cofinanciación del MINECO en el marco del Programa INNCIDE 2011 (OTR-2011-0236)
Cofinanciación del MINECO en el marco del Programa INNPACTO (IPT-020000-2010-22)