Observatorio de I+D+i UPM

Memorias de investigación
Ponencias en congresos:
Analysis of the Mechanical Properties of Multicrystalline and Monocrystalline Silicon Wafers Manufactured by Casting Methods
Año:2011
Áreas de investigación
  • Ingenierías,
  • Tecnología electrónica y de las comunicaciones,
  • Ingenieria mecanica
Datos
Descripción
Quasi-monocrystalline silicon wafers have appeared as a critical innovation in the PV industry, joining the most favourable characteristics of the conventional substrates: the higher solar cell efficiencies of monocrystalline Czochralski-Si (Cz-Si) wafers and the lower cost and the full square-shape of the multicrystalline ones. However, the quasi-mono ingot growth can lead to a different defect structure than the typical Cz-Si process. Thus, the properties of the brand-new quasi-mono wafers, from a mechanical point of view, have been for the first time studied, comparing their strength with that of both Cz-Si mono and typical multicrystalline materials. The study has been carried out employing the four line bending test and simulating them by means of FE models. For the analysis, failure stresses were fitted to a three-parameter Weibull distribution. High mechanical strength was found in all the cases. The low quality quasi-mono wafers, interestingly, did not exhibit critical strength values for the PV industry, despite their noticeable density of extended defects.
Internacional
Si
Nombre congreso
5th International Workshop on Science and Technology of Crystalline Silicon Solar Cells (CSSC-5)
Tipo de participación
960
Lugar del congreso
Boston, USA
Revisores
Si
ISBN o ISSN
00-0000-000-0
DOI
Fecha inicio congreso
01/11/2011
Fecha fin congreso
03/11/2011
Desde la página
0
Hasta la página
0
Título de las actas
Poster en Workshop
Esta actividad pertenece a memorias de investigación
Participantes
  • Autor: Josu Barredo Egusquiza (UPM)
  • Autor: Lutz Karl Heinz Hermanns (UPM)
  • Autor: Alberto Fraile de Lerma (UPM)
  • Autor: Miguel Miranda (DC Wafers)
  • Autor: Ismael Guerrero (DC Wafers)
  • Autor: Vicente Parra (DC Wafers)
Grupos de investigación, Departamentos, Centros e Institutos de I+D+i relacionados
  • Creador: Grupo de Investigación: Ingeniería Sísmica: Dinámica de Suelos y Estructuras
  • Departamento: Mecánica Estructural y Construcciones Industriales
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