Memorias de investigación
Ponencias en congresos:
Study of the Effect of Different Hole Sizes on Mechanical Strength of Wafers for Back Contact Solar Cells
Año:2012
Áreas de investigación
  • Ingenierías
Datos
Descripción
Drilling process on wafers to produce EWT or MWT solar cells is a critical fabrication step, which affects on their mechanical stability. The amount of damage introduced during drilling process depends on the density of holes, their size and the chemical process applied afterwards. To quantify the relation between size of the holes and reduction of mechanical strength, several sets of wafers have been prepared, with different hole diameter. The mechanical strength of these sets has been measured by the ring on ring bending test, and the stress state in the moment of failure has been deduced by FE simulation
Internacional
Si
Nombre congreso
38th IEEE Photovoltaic Specialists Conference (PVSC)
Tipo de participación
960
Lugar del congreso
Austin, Texas
Revisores
Si
ISBN o ISSN
978-1-4673-0064-3
DOI
DOI: 10.1109/PVSC.2012.6317602
Fecha inicio congreso
03/06/2012
Fecha fin congreso
08/06/2012
Desde la página
209
Hasta la página
212
Título de las actas
Proceedings of Photovoltaic Specialists Conference (PVSC), 2012 38th IEEE
Esta actividad pertenece a memorias de investigación
Participantes
Grupos de investigación, Departamentos, Centros e Institutos de I+D+i relacionados
  • Creador: Grupo de Investigación: Ingeniería Sísmica: Dinámica de Suelos y Estructuras