Memorias de investigación
Communications at congresses:
Study of the Effect of Different Hole Sizes on Mechanical Strength of Wafers for Back Contact Solar Cells
Year:2012
Research Areas
  • Engineering
Information
Abstract
Drilling process on wafers to produce EWT or MWT solar cells is a critical fabrication step, which affects on their mechanical stability. The amount of damage introduced during drilling process depends on the density of holes, their size and the chemical process applied afterwards. To quantify the relation between size of the holes and reduction of mechanical strength, several sets of wafers have been prepared, with different hole diameter. The mechanical strength of these sets has been measured by the ring on ring bending test, and the stress state in the moment of failure has been deduced by FE simulation
International
Si
Congress
38th IEEE Photovoltaic Specialists Conference (PVSC)
960
Place
Austin, Texas
Reviewers
Si
ISBN/ISSN
978-1-4673-0064-3
DOI: 10.1109/PVSC.2012.6317602
Start Date
03/06/2012
End Date
08/06/2012
From page
209
To page
212
Proceedings of Photovoltaic Specialists Conference (PVSC), 2012 38th IEEE
Participants
Research Group, Departaments and Institutes related
  • Creador: Grupo de Investigación: Ingeniería Sísmica: Dinámica de Suelos y Estructuras