Memorias de investigación
Communications at congresses:
Temperature Sensor Placement Including Routing Overhead and Sampling Inaccuracies
Year:2012
Research Areas
  • Electronic circuits,
  • Microelectronic design,
  • Sensor devices
Information
Abstract
Dynamic thermal management techniques require a collection of on-chip thermal sensors that imply a significant area and power overhead. Finding the optimum number of temperature monitors and their location on the chip surface to optimize accuracy is an NP-hard problem. In this work we improve the modeling of the problem by including area, power and networking constraints along with the consideration of three inaccuracy terms: spatial errors, sampling rate errors and monitor-inherent errors. The problem is solved by the simulated annealing algorithm. We apply the algorithm to a test case employing three different types of monitors to highlight the importance of the different metrics. Finally we present a case study of the Alpha 21364 processor under two different constraint scenarios.
International
Si
Congress
Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), 2012 International Conference on
960
Place
Sevilla
Reviewers
Si
ISBN/ISSN
978-1-4673-0685-0
10.1109/SMACD.2012.6339419
Start Date
19/09/2012
End Date
21/09/2012
From page
69
To page
72
Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), 2012 International Conference on
Participants
Research Group, Departaments and Institutes related
  • Creador: Grupo de Investigación: Laboratorio de Sistemas Integrados (LSI)
  • Departamento: Ingeniería Electrónica