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Memorias de investigación
Ponencias en congresos:
Accelarated life tests of lead free solder alloys in presence of distilled water
Año:2013
Áreas de investigación
  • Tecnología electrónica y de las comunicaciones
Datos
Descripción
The Restriction of Hazardous Substances (RoHS) in electronic equipment imposed by legal considerations does not allow the manufacture of electronic equipments with alloys containing lead. As an ecological alternative, it can be used lead free alloys. Electrochemical migration is a reliability problem in printer circuit boards in high humidity environments. In this paper, the electrochemical migration of one solder that contains lead (Sn36Pb2Ag) and two lead free solder alloys (Sn3.5Ag and Sn3.8Ag0.7Cu) were analyzed under presence of distilled water. It was analyzed the failure distribution times of three different types of solder pastes, with three voltages, and three strip spacing. Lead free solder pastes are more reliable than paste that contains lead. Exponential-Weibull model was the more adequate for the test results.
Internacional
Si
Nombre congreso
9th Spanish Conference on Electron Devices
Tipo de participación
960
Lugar del congreso
Valladolid
Revisores
Si
ISBN o ISSN
2163-4971
DOI
Fecha inicio congreso
12/02/2013
Fecha fin congreso
14/02/2013
Desde la página
249
Hasta la página
251
Título de las actas
Proceedings of 9th Spanish Conference on Electron Devices
Esta actividad pertenece a memorias de investigación
Participantes
  • Autor: Eduardo Nogueira Diaz (UPM)
Grupos de investigación, Departamentos, Centros e Institutos de I+D+i relacionados
  • Creador: Grupo de Investigación: Integración de Sistemas e Instrumentos (ISI)
  • Departamento: Electrónica Física
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