Memorias de investigación
Communications at congresses:
Sputtered Al(1-x)ScxN thin films with high areal uniformity for mass production
Year:2015

Research Areas
  • Electronic technology and of the communications

Information
Abstract
In this work, we describe a sputter technique enabling deposition of AlScN thin films with homogeneous thickness and composition on production size wafers (150-200 mm) and present some preliminary results on the assessment of the structural and piezoelectric properties of the films with Sc content of about 6.5 at.%. The technique is based on the use of pure Sc ingots embedded into the Al targets of the dual-target S-gun magnetron enabling reactive sputtering with high radial thickness and composition homogeneity. Rutherford backscattering was carried out to obtain the film composition. The microstructure and morphology were assessed by X-ray diffraction. Density was determined by X-ray grazing angle reflectometry. Electroacoustic properties and dielectric constant were derived from the frequency response of BAW test resonators. 1 ?m thick films showed wurtzite structure with pure c-axis orientation and rocking curves of the (00?2) diffraction peak with FWHM as low as 1.5º. Film properties appear to be uniform across 150-mm wafers. The material electromechanical coupling factor reached 9%, although the sound velocity of longitudinal mode was relatively low (around 8500 m/s).
International
Si
Congress
IEEE Joint Conference IFCS-EFTF
970
Place
Denver (Colorado)
Reviewers
Si
ISBN/ISSN
DOI: 10.1109/FCS.2015.7138803
Start Date
12/04/2015
End Date
16/04/2015
From page
1
To page
4
Proceedings in IEEE Joint Conference IFCS-EFTF
Participants

Research Group, Departaments and Institutes related
  • Creador: Departamento: Ingeniería Electrónica