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Descripción
This paper presents a complete modeling approach to analyze the thermal behavior of microprocessor-based systems. While most compact modeling approaches require a deep knowledge of the implementation details, our method defines a black box technique which can be applied to different target processors when this detailed information is unknown. The obtained results show high accuracy, applicability and can be easily automated. The proposed methodology has been used to study the impact of code transformations in the thermal behavior of the chip. Finally, the analysis of the thermal effect of the source code modifications can be included in a temperature-aware compiler which minimizes the total temperature of the chip, as well as the temperature gradients, according to these guidelines.
Internacional	Si
JCR del ISI	Si
Título de la revista	COMPUTERS AND ELECTRICAL ENGINEERING
ISSN	0045-7906
Factor de impacto JCR	0,475
Información de impacto
Volumen	36
DOI
Número de revista	1
Desde la página	142
Hasta la página	154
Mes	ENERO
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• Autor: M. Luisa Lopez Vallejo (UPM)

• Creador: Grupo de Investigación: Laboratorio de Sistemas Integrados (LSI)
• Departamento: Ingeniería Electrónica