Artículos en revistas:
Thermal analysis and modeling of embedded processors
Año:2010
Áreas de investigación
- Microelectrónica
Datos
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Descripción
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| This paper presents a complete modeling approach to analyze the thermal behavior of microprocessor-based systems. While most compact modeling approaches require a deep knowledge of the implementation details, our method defines a black box technique which can be applied to different target processors when this detailed information is unknown. The obtained results show high accuracy, applicability and can be easily automated. The proposed methodology has been used to study the impact of code transformations in the thermal behavior of the chip. Finally, the analysis of the thermal effect of the source code modifications can be included in a temperature-aware compiler which minimizes the total temperature of the chip, as well as the temperature gradients, according to these guidelines. | |
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Internacional
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Si |
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JCR del ISI
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Si |
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Título de la revista
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COMPUTERS AND ELECTRICAL ENGINEERING |
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ISSN
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0045-7906 |
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Factor de impacto JCR
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0,475 |
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Información de impacto
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Volumen
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36 |
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DOI
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Número de revista
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1 |
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Desde la página
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142 |
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Hasta la página
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154 |
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Mes
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ENERO |
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Ranking
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Participantes
- Autor: M. Luisa Lopez Vallejo UPM
Grupos de investigación, Departamentos, Centros e Institutos de I+D+i relacionados
- Creador: Grupo de Investigación: Laboratorio de Sistemas Integrados (LSI)
- Departamento: Ingeniería Electrónica