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Abstract
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| The dynamic and thermal fields within an electronic case are analysed numerically using the finite volume method. An experimental test rig is also developed for the thermal analysis of the electronic components. | |
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International
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Si |
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Congress
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5th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics |
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960 |
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Place
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Sun City (South Africa) |
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Reviewers
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Si |
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ISBN/ISSN
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978-1-86854-643-5 |
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Start Date
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01/07/2007 |
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End Date
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04/07/2007 |
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